半導体製造装置用語集
計測 (metrology)
１．形状観察
２．欠陥検査
- ADC (Automatic Defect Classification)
- ADR (Automatic Defect Review)
- DUV (Deep Ultra Violet)
- EDX (Energy Dispersive X-Ray Spectroscopy)
- EPMA (Electron Probe Micro Analyzer)
- FIB (Focused Ion Beam)
- HAR (High Aspect Ratio)
- MDC (Manual Defect Classification)
- SEM (Scanning Electron Microscope)
- UV (Ultra Violet)
- XPS (X-ray Photoelectron Spectrometer)
- YMS (Yield Management System)
- DFM (Desigh For Manufacturability / Manufacturing) 製造のための最適設計